Shelby Township, MI, United States of America

Tejaswi Vemuri

This inventor holds 1 USPTO granted patent. Top assignee: Magna Exteriors Gmbh. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Tejaswi Vemuri. Retrieved from https://idiyas.com/inventor/tejaswi-vemuri-g9zjitza

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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Average Co-Inventor Count = 1.0


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Tejaswi Vemuri and an Efficient Liftgate Bonding Structure.

Introduction

Tejaswi Vemuri is an inventor associated with Shelby Township, Michigan, and Magna Exteriors GmbH. Her work includes an invention focused on improving how liftgate components are bonded together.

Latest Patents

Vemuri is credited with 1 patent, titled “Bonding Structure Efficiently.” The invention describes a liftgate with metallic reinforcements designed with strategically placed flanges, openings, notches, slots, holes, steps, or adhesive gaps. These features allow adhesive to flow around and through the reinforcements, helping bond them to mating panels from multiple sides. Adhesive can also be mechanically captured through openings and into undercut pockets in the mating parts.

Career Highlights

The patent reflects an approach to liftgate construction that combines adhesive bonding with mechanical capture. By shaping the reinforcements and their surrounding features to guide and retain adhesive, the design aims to support secure connections between liftgate components.

Collaborations

Vemuri’s listed coworker is Stanislav Tichy. The provided information does not specify further details about their collaboration.

Conclusion

Tejaswi Vemuri’s patent presents a liftgate bonding design that uses strategically configured metallic reinforcements and adhesive pathways to connect mating components.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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