Company Filing History:
Years Active: 2010-2016
Title: Teck Yang Tan: Innovator in Semiconductor Technology
Introduction
Teck Yang Tan is a prominent inventor based in Singapore, known for his contributions to semiconductor technology. With a total of 3 patents, he has made significant advancements in methods and systems for semiconductor devices.
Latest Patents
One of his latest patents is titled "Flexible routing for chip on board applications." This invention provides methods, systems, and apparatuses for semiconductor devices, which include an array of conductive pads for signals. The design incorporates one or more non-linear compliant springs that route signals from the conductive pads to interconnect pads on the semiconductor device. This innovation allows for compliance between the conductive pads and bump interconnects, accommodating different rates of thermal expansion during operation.
Another notable patent is "Package-on-package technology for fan-out wafer-level packaging." This patent describes methods, systems, and apparatuses for wafer-level package-on-package structures. It involves forming a wafer-level integrated circuit package that includes at least one die, with redistribution interconnects that expand the area of terminals over the die's active surface. This technology enables the mounting of a second integrated circuit package to create a package-on-package structure, enhancing electrical connectivity.
Career Highlights
Teck Yang Tan is currently employed at Broadcom Corporation, where he continues to innovate in the field of semiconductor technology. His work has contributed to the advancement of integrated circuit packaging and signal routing.
Collaborations
Throughout his career, Teck Yang Tan has collaborated with notable colleagues, including Matthew Vernon Kaufmann and Milind S Bhagavat. These collaborations have further enriched his contributions to the field.
Conclusion
Teck Yang Tan's innovative work in semiconductor technology, particularly in flexible routing and package-on-package structures, showcases his expertise and commitment to advancing the industry. His patents reflect a deep understanding of the challenges in semiconductor design and offer practical solutions for future developments.