Southfield, MI, United States of America

Teck-Mun Soo

This inventor holds 4 USPTO granted patents and 4 published patent applications. Top assignees: Omnia Medical, LLC, Orthocision Inc., Other. Active years: 2019-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Teck-Mun Soo. Retrieved from https://idiyas.com/inventor/teck-mun-soo

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 4 

% Patents Active = 50.0

Average Co-Inventor Count = 4.0

ph-index = 3

Forward Citations = 121(Granted Patents)


Company Filing History:


Years Active: 2019-2026

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4 patents (USPTO):Explore Patents

Title: Teck-Mun Soo: Pioneering Inventor from Southfield

Introduction: Teck-Mun Soo is a renowned inventor hailing from Southfield, Michigan. His innovative spirit and dedication to technological advancements have made him a prominent figure in the world of patents and inventions.

Latest Patents: Teck-Mun Soo holds several groundbreaking patents in various fields such as electronics, renewable energy, and healthcare. His recent patents focus on sustainable energy solutions and cutting-edge medical devices.

Career Highlights: With a career spanning over two decades, Teck-Mun Soo has worked with leading research institutions and tech companies to bring his inventions to life. His contributions have significantly impacted the way we approach modern challenges.

Collaborations: Throughout his career, Teck-Mun Soo has collaborated with top engineers, scientists, and designers to push the boundaries of innovation. His ability to work in multidisciplinary teams has led to the development of revolutionary products.

Conclusion: Teck-Mun Soo's passion for innovation and his relentless drive to create a better future through his inventions make him a true pioneer in the field of technology. His work continues to inspire the next generation of inventors and innovators worldwide.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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