Company Filing History:
Years Active: 2007
Title: Teck Leong Neo: Innovator in Chemical/Mechanical Polishing Technologies
Introduction
Teck Leong Neo is a notable inventor based in Singapore, recognized for his contributions to the field of chemical and mechanical polishing technologies. With a total of two patents to his name, Neo has made significant advancements that enhance the efficiency and effectiveness of wafer processing.
Latest Patents
Neo's latest patents include an innovative polishing head elbow fitting and a process for producing improved membranes. The polishing head elbow fitting introduces an improvement for a wafer carrier that features an annular inflatable tube designed to exert pressure on the edge of a perforated plate during wafer dechucking. This invention includes a fixed elbow fitting that is secured to the head assembly in a specific orientation, ensuring that the flexible plastic tube supplying pressure to the inflatable tube remains unobstructed. Additionally, Neo has developed a tool that assists in fitting the elbow in the predetermined orientation, enhancing the overall functionality of the polishing head.
The second patent focuses on a method for producing improved membranes used in chemical and mechanical polishing systems. This method involves subjecting the flexible membrane to elevated temperatures to enhance its properties, thereby improving its performance in polishing applications.
Career Highlights
Teck Leong Neo is currently employed at Systems on Silicon Manufacturing Company Pte. Ltd., where he continues to innovate and contribute to advancements in semiconductor manufacturing technologies. His work has been instrumental in developing solutions that address the challenges faced in the polishing process of substrates.
Collaborations
Neo has collaborated with notable colleagues, including Meng Fei Koh and Bing Wang, who have contributed to his projects and innovations in the field.
Conclusion
Teck Leong Neo's contributions to the field of chemical and mechanical polishing technologies demonstrate his commitment to innovation and excellence. His patents reflect a deep understanding of the complexities involved in wafer processing, making him a valuable asset in the industry.