Singapore, Singapore

Teck Hwa Ho

This inventor holds 1 USPTO granted patent. Top assignee: Abrasive Engineering Pte. Ltd.. Active years: 2023.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Teck Hwa Ho. Retrieved from https://idiyas.com/inventor/teck-hwa-ho

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 7.0

ph-index = 1


Company Filing History:


Years Active: 2023

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1 patent (USPTO):Explore Patents

Title: Teck Hwa Ho: Innovator in Shot Peening Technology

Introduction

Teck Hwa Ho is a notable inventor based in Singapore, recognized for his contributions to the field of shot peening technology. He has developed innovative solutions that enhance the efficiency and effectiveness of media dosage units used in this process.

Latest Patents

Teck Hwa Ho holds a patent for a "Media dosage unit for shot peening, method of using the unit for shot peening and method of making the unit." This patent outlines a media dosage unit designed for shot peening, which includes a flow sensor for measuring the flow rate of solid particles. The unit also features a connector for coupling the flow sensor to a shot circulation conduit. Additionally, the patent describes a media flow valve for the media dosage unit and methods for making or assembling the microwave media flow sensor. He has 1 patent to his name.

Career Highlights

Teck Hwa Ho is currently employed at Abrasive Engineering Pte. Ltd., where he applies his expertise in developing advanced shot peening technologies. His work has significantly contributed to the improvement of processes within the industry.

Collaborations

Teck Hwa Ho collaborates with talented professionals such as Yuet Kwan Lim and Chong Wei Lee, enhancing the innovative capabilities of his team.

Conclusion

Teck Hwa Ho's work in shot peening technology exemplifies the impact of innovation in engineering. His contributions continue to advance the field and inspire future developments.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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