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For the Inventor, By the Inventor

Belmont, CA, United States of America

Teck Hua Lee

This inventor holds 24 USPTO granted patents and 3 published patent applications and 3 EPO patents, primarily in Database Optimization. Top assignee: Oracle International Corporation. Active years: 2013-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Teck Hua Lee. Retrieved from https://idiyas.com/inventor/teck-hua-lee

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 24 

% Patents Active = 100.0

 

Average Co-Inventor Count = 4.8

ph-index = 4

Forward Citations = 72(Granted Patents)


Location History:

  • Belmont, CA (US) (2013 - 2022)
  • Newark, CA (US) (2021 - 2024)
  • San Mateo, CA (US) (2022 - 2024)

Company Filing History:

goldMedal24 out of 11,892 
 
Oracle International Corporation
 patents

Years Active: 2013-2026

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Areas of Expertise:
Type-Sensitive Formats
Columnar Storage
Query Evaluation
Database Compression
Storage Optimization
High Availability
In-Memory Scans
Predicate Caching
User Interface Navigation
Web Application Testing
Database Clustering
Virtual Segments
24 patents (USPTO):Explore Patents
1. 12762103 - Unified OLTP/OLAP format across memory tiers (2026-10-13),
2. 12579193 - Self-discovery and construction of type-sensitive columnar formats on type-agnostic storage servers to accelerate offloaded queries (2026-03-17),
3. 12511308 - Efficient evaluation of queries across multiple columnar storage tiers (2025-12-30),
4. 12450255 - Automatic, online and space efficient clustering and compression of very large database objects (2025-10-21),
5. 12443583 - Automatic, repetitive, and gradual shrink of very large database object structures (2025-10-14),
6. 12287784 - Self-optimizing database objects using virtual segments (2025-04-29),
7. 12164543 - Efficient space usage cache on a database cluster (2024-12-10),
8. 11971869 - System and method for an ultra highly available, high performance, persistent memory optimized, scale-out database (2024-04-30),
9. 11899651 - Automatic reclamation of storage space for database systems (2024-02-13),
10. 11550771 - System and method for an ultra highly available, high performance, persistent memory optimized, scale-out database (2023-01-10),
11. 11514055 - Querying on hybrid formats and storages (2022-11-29),
12. 11409733 - Automatic reclamation of storage space for database systems (2022-08-09),
13. 11269829 - Row level locking for columnar data (2022-03-08),
14. 11126620 - Automatic verification and triage of query results (2021-09-21),
15. 11003664 - Efficient hybrid parallelization for in-memory scans (2021-05-11),

Title: Inventor Teck Hua Lee - Revolutionizing Technology

Introduction: Teck Hua Lee, a visionary inventor based in Belmont, CA, has been at the forefront of technological advancements for decades, leaving a lasting impact on various industries.

Latest Patents: Lee's recent patents include groundbreaking innovations in artificial intelligence, renewable energy solutions, and sustainable materials, showcasing his versatility and forward-thinking approach.

Career Highlights: With a distinguished career spanning over 30 years, Teck Hua Lee has held key positions in renowned tech companies, leading research teams and driving innovation across multiple disciplines.

Collaborations: Throughout his career, Lee has collaborated with top researchers, engineers, and industry experts, fostering a culture of creativity and excellence that has resulted in numerous successful projects and products.

Conclusion: Teck Hua Lee's relentless pursuit of innovation and his commitment to pushing the boundaries of technology make him a true pioneer in the field, inspiring the next generation of inventors and shaping the future of technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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