Company Filing History:
Years Active: 2012-2016
Title: Innovations by Teck Beng Lau: Advancements in Integrated Circuit Technology
Introduction: Teck Beng Lau, an accomplished inventor based in Petaling Jaya, Malaysia, has made significant contributions to the field of semiconductor technology. With a total of six patents to his name, Lau's innovative work focuses on enhancing the functionality and efficiency of integrated circuits, particularly through novel assembly methods.
Latest Patents: Among Lau's latest patents are two groundbreaking inventions: the Flexible Packaged Integrated Circuit and the Multi-die Sensor Device. The Flexible Packaged Integrated Circuit patent describes a method for assembling a thin, flexible integrated circuit (IC) device. This process involves using an etched contoured lead frame with raised features, allowing a die to be attached and selectively coated with a low-modulus gel. Following this, the sub-assembly undergoes sputter deposition and electroplating for robust metal interconnects, and is ultimately reinforced with additional gel layers to complete the assembly.
The Multi-die Sensor Device patent outlines a semiconductor platform that includes a lead frame with a flag and surrounding leads, integrating innovative electrical connections. This design features a dummy lead with wire bonding areas that ties two semiconductor dies, facilitating their interaction while providing a compact and efficient structure.
Career Highlights: Teck Beng Lau currently contributes to the advancements in semiconductor technology at Freescale Semiconductor, Inc. His role involves not only individual inventiveness but also working towards the company's larger goals of innovation in the electronics sector. His six patents reflect his dedication and expertise in this field.
Collaborations: Lau's inventive journey is supported by collaborations with notable coworkers such as Wai Yew Lo and Chin Teck Siong. Together, they have bridged gaps in technology by pooling their knowledge and skills, thereby creating solutions that enhance electronic device capabilities.
Conclusion: Teck Beng Lau stands out as a significant figure in the realm of integrated circuit innovation. His patents not only demonstrate his technical brilliance but also contribute to the broader advancement of technology in the semiconductor industry. As innovations evolve, Lau’s contributions will continue to resonate within the field, inspiring future generations of inventors.