The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 15, 2016
Filed:
Jul. 17, 2014
Teck Beng Lau, Petaling Jaya, MY;
Chee Seng Foong, Sungai Buloh, MY;
Chin Teck Siong, Shah Alam, MY;
Teck Beng Lau, Petaling Jaya, MY;
Chee Seng Foong, Sungai Buloh, MY;
Chin Teck Siong, Shah Alam, MY;
FREESCALE SEMICONDUCTOR, INC., Austin, TX (US);
Abstract
A method for assembling a thin, flexible integrated circuit (IC) device includes using an etched contoured lead frame having raised features. A die is attached to the lead frame to form a sub-assembly that is then selectively coated with a low-modulus gel. The sub-assembly is covered with a temporary mask for sputter deposition of a metallic seed layer for interconnects between the die and the raised features. The mask is removed and more robust metal interconnects are grown over the seed paths using electroplating. The sub-assembly top is then coated with another gel layer. The bottom of the sub-assembly and of the contoured lead frame is removed, which transforms the raised features into leads. The newly exposed bottom of the sub-assembly is covered with a third layer of gel to complete assembly of the packaged device.