Company Filing History:
Years Active: 2014
Title: Tean Wee One: Innovator in Flip Chip Assembly Technology
Introduction
Tean Wee One is a notable inventor based in Penang, Malaysia. He has made significant contributions to the field of electronic substrates, particularly through his innovative patent related to flip chip assembly processes. His work is instrumental in advancing technology in the electronics industry.
Latest Patents
Tean Wee One holds a patent for a "Flip chip assembly process for ultra thin substrate and package on package assembly." This patent presents a method that includes receiving a coreless substrate strip, attaching solder balls to the backside of the coreless substrate strip, and forming a backside stiffening mold amongst the solder balls. The patent also discloses other embodiments that are claimed, showcasing his inventive approach to electronic assembly.
Career Highlights
Tean Wee One is currently employed at Intel Corporation, a leading company in technology and innovation. His role at Intel allows him to work on cutting-edge projects that push the boundaries of electronic manufacturing. With 1 patent to his name, he has established himself as a valuable contributor to the field.
Collaborations
Throughout his career, Tean has collaborated with talented individuals such as Weng Khoon Mong and A Vethanayagam Rudge. These collaborations have likely enriched his work and contributed to the success of various projects.
Conclusion
Tean Wee One is a distinguished inventor whose work in flip chip assembly technology has made a significant impact in the electronics industry. His innovative patent and contributions at Intel Corporation highlight his dedication to advancing technology.