Te-Kun Liu

Title: Te-Kun Liu: Innovator in Electrostatic Discharge Protection

Introduction

Te-Kun Liu is a notable inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of electrostatic discharge (ESD) protection. His innovative work has led to the development of a unique patent that addresses critical challenges in electronic device safety.

Latest Patents

Te-Kun Liu holds a patent for an "Electrostatic discharge protection structure." This ESD protection structure includes a first conductive type substrate, first and second well regions of a first conductive type, and a third well region of a second conductive type located between the first and second well regions. The design features a first doped region of the first conductive type and a second doped region of the second conductive type disposed in the first well region. Additionally, it includes a third doped region of the first conductive type and a fourth doped region of the second conductive type in the second well region. The structure also incorporates fifth and sixth doped regions at the interfaces of the well regions, enhancing its protective capabilities.

Career Highlights

Te-Kun Liu is currently employed at Episil Technologies Inc., where he continues to innovate and develop advanced technologies. His work at the company has positioned him as a key player in the field of semiconductor technology.

Collaborations

Te-Kun Liu collaborates with Jing-Sheng Deng, who is also a valuable member of his team. Their combined expertise contributes to the advancement of ESD protection technologies.

Conclusion

Te-Kun Liu's contributions to electrostatic discharge protection highlight his innovative spirit and dedication to enhancing electronic device safety. His patent and ongoing work at Episil Technologies Inc. reflect his commitment to advancing technology in this critical area.