Ageoshi, Japan

Tatsuya Sudo

This inventor holds 1 USPTO granted patent. Top assignee: Mitsui Minings & Melting Co., Ltd.. Active years: 2001.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Tatsuya Sudo. Retrieved from https://idiyas.com/inventor/tatsuya-sudo-23gchzmz

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 6.0

ph-index = 1

Forward Citations = 5(Granted Patents)


Company Filing History:


Years Active: 2001

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1 patent (USPTO):Explore Patents

Title: Tatsuya Sudo: Innovator in Copper Foil Technology

Introduction

Tatsuya Sudo is a notable inventor based in Ageoshi, Japan. He has made significant contributions to the field of materials science, particularly in the development of copper foil for printed circuit boards. His innovative work has led to advancements that enhance the manufacturing process of electronic components.

Latest Patents

Tatsuya Sudo holds 1 patent for his invention titled "Copper foil for printed circuit boards." This patent describes a copper foil that features improved resistance to abrasion damage during the manufacturing process. The foil includes a uniform deposit of benzotriazole (BTA) or a BTA derivative, with a minimum concentration of about 5 mg/m², which significantly enhances its durability.

Career Highlights

Sudo is currently employed at Mitsui Mining & Smelting Company, Ltd., where he continues to innovate and contribute to the field of materials engineering. His work at this esteemed company has positioned him as a key player in the development of advanced materials for electronic applications.

Collaborations

Tatsuya Sudo has collaborated with several talented individuals in his field, including Makoto Dobashi and Hiroaki Kurihara. These collaborations have fostered a creative environment that encourages the exchange of ideas and the development of cutting-edge technologies.

Conclusion

Tatsuya Sudo's contributions to the field of copper foil technology exemplify the importance of innovation in the manufacturing of electronic components. His work not only enhances product quality but also paves the way for future advancements in the industry.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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