Hikari, Japan

Tatsuhito Kunihiro

This inventor holds 1 USPTO granted patent. Top assignee: Hitachi Plant Technologies, Ltd.. Active years: 2013.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Tatsuhito Kunihiro. Retrieved from https://idiyas.com/inventor/tatsuhito-kunihiro

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


Average Co-Inventor Count = 3.0

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:


Years Active: 2013

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1 patent (USPTO):Explore Patents

Title: Innovations of Tatsuhito Kunihiro

Introduction

Tatsuhito Kunihiro is a notable inventor based in Hikari, Japan. He has made significant contributions to the field of substrate laminating technology. His work focuses on enhancing the accuracy and efficiency of substrate bonding processes.

Latest Patents

Kunihiro holds a patent for a substrate laminating apparatus. This innovative apparatus is designed to stick substrates together in a vacuum with high precision. It features a first chamber for carrying two substrates, a second chamber for bonding them, and a third chamber for delivering the substrate laminate. The pressure levels in the first and third chambers can be adjusted from atmospheric to medium vacuum, while the second chamber operates from medium vacuum to high vacuum. This controlled environment ensures optimal conditions for substrate adhesion.

Career Highlights

Kunihiro is associated with Hitachi Plant Technologies, Ltd., where he applies his expertise in substrate technology. His work has been instrumental in advancing the capabilities of substrate laminating processes. He has a strong focus on innovation and quality in his projects.

Collaborations

Some of his notable coworkers include Masaru Mitsumoto and Shigeo Watanabe. Their collaboration has contributed to the development of advanced technologies in the field.

Conclusion

Tatsuhito Kunihiro's contributions to substrate laminating technology exemplify the importance of innovation in engineering. His patent reflects a commitment to precision and efficiency in manufacturing processes.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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