Tatsuaki Kitagawa

Title: Tatsuaki Kitagawa: Innovator in Reflow Soldering Technology

Introduction

Tatsuaki Kitagawa is a notable inventor based in Fukushima, Japan. He has made significant contributions to the field of electronics, particularly in the area of reflow soldering technology. With a total of 2 patents, Kitagawa's innovations have enhanced the efficiency and effectiveness of soldering processes in electronic manufacturing.

Latest Patents

Kitagawa's latest patents focus on a reflow method and reflow device designed for reflow soldering. This innovative method applies radiant heating to one surface of a printed circuit board, where electronic components are placed and cream solder is supplied. Simultaneously, hot air is blown locally and roughly perpendicular to the points that need to be connected on the printed circuit board. This approach allows for secure soldering, even when the hot air temperature does not exceed the heat resistance of the electronic components. The combination of radiant heat with localized hot air ensures that only the to-be-connected points are heated selectively. This prevents heat damage to other sections of the board and guarantees that the solder at the connection points is effectively melted.

Career Highlights

Tatsuaki Kitagawa is associated with Matsushita Electric Industrial Co., Ltd., a company known for its advancements in electronic technology. His work has been instrumental in developing methods that improve the reliability and quality of electronic assemblies.

Collaborations

Kitagawa has collaborated with notable coworkers, including Masahiro Taniguchi and Kazumi Ishimoto. Their combined expertise has contributed to the successful development of innovative soldering techniques.

Conclusion

Tatsuaki Kitagawa's contributions to reflow soldering technology exemplify the importance of innovation in the electronics industry. His patents reflect a commitment to enhancing manufacturing processes and ensuring the reliability of electronic components.