Tansel Karabacak

Title: Tansel Karabacak: Innovator in Integrated Circuit Fabrication

Introduction

Tansel Karabacak is a notable inventor based in Troy, NY (US), recognized for his contributions to the field of integrated circuit fabrication. With a focus on enhancing the step coverage of thin films, he has developed innovative methods that significantly improve the manufacturing process of electronic components.

Latest Patents

Karabacak holds a patent for "Enhanced step coverage of thin films on patterned substrates by oblique angle PVD." This invention involves a method and apparatus for fabricating integrated circuits by directing a vapor flux toward a substrate surface from multiple directions associated with various azimuth angles. By selecting a deposition angle of the vapor flux relative to normal incidence, the process achieves a substantially conformal film. This technology is particularly beneficial for surface features such as vias and trenches.

Career Highlights

Tansel Karabacak is affiliated with Rensselaer Polytechnic Institute, where he continues to advance research in semiconductor technology. His work has contributed to the understanding and improvement of thin film deposition techniques, which are critical in the production of modern electronic devices.

Collaborations

Throughout his career, Karabacak has collaborated with esteemed colleagues, including Toh-Ming Lu and John Robert Barthel. These partnerships have fostered a rich environment for innovation and have led to significant advancements in the field.

Conclusion

Tansel Karabacak's innovative work in integrated circuit fabrication exemplifies the impact of research and development in technology. His contributions continue to shape the future of semiconductor manufacturing.