Company Filing History:
Years Active: 2021-2023
Title: Tanawan Chaowasakoo: Innovator in Semiconductor Packaging
Introduction
Tanawan Chaowasakoo is a prominent inventor based in Bangkok, Thailand. He has made significant contributions to the field of semiconductor packaging, holding 2 patents that showcase his innovative approach to device design and manufacturing.
Latest Patents
His latest patents include advancements in semiconductor packages and methods of packaging semiconductor devices. One embodiment describes a device that features a first die with both first and second die surfaces. The second die surface is bonded to a first die attach pad (DAP) on a package substrate, while the first die surface includes a first die contact pad. Additionally, the device incorporates a first clip bond that connects the first die contact pad to a substrate bond pad, ensuring a reliable connection. Another patent outlines a method for forming a device that involves creating a conductive bonding layer with spacers, which helps maintain a uniform Bond Line Thickness (BLT) during the manufacturing process.
Career Highlights
Tanawan Chaowasakoo is currently employed at Utac Headquarters Pte. Ltd., where he continues to develop innovative solutions in semiconductor technology. His work has positioned him as a key player in the industry, contributing to advancements that enhance device performance and reliability.
Collaborations
Throughout his career, Tanawan has collaborated with notable colleagues, including Hua Hong Tan and Alexander Lucero Laylo. These partnerships have fostered a creative environment that encourages the exchange of ideas and expertise.
Conclusion
Tanawan Chaowasakoo's contributions to semiconductor packaging reflect his dedication to innovation and excellence in engineering. His patents not only advance technology but also pave the way for future developments in the field.