Fukui, Japan

Tanaka Katsunori

This inventor holds 1 USPTO granted patent and 8 EPO patents. Top assignees: Aisin Aw Co., Ltd., Aisin Aw Industries Co., Ltd.. Active years: 2020.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Tanaka Katsunori. Retrieved from https://idiyas.com/inventor/tanaka-katsunori

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

 

Average Co-Inventor Count = 5.0

ph-index = 1


Company Filing History:


Years Active: 2020

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1 patent (USPTO):Explore Patents

Title: Tanaka Katsunori: Innovator in Damper Device Technology

Introduction

Tanaka Katsunori is a notable inventor based in Fukui, Japan. He has made significant contributions to the field of mechanical engineering, particularly with his innovative damper device. His work has garnered attention for its practical applications in various industries.

Latest Patents

Tanaka holds a patent for a damper device that features an elastic body support. This support is designed to hold both end portions of a third elastic body, especially when torque is not transferred between the input and output. The device also includes an elastic body abutment that interacts with the third elastic body as torque is transferred, showcasing a unique approach to managing torque dynamics.

Career Highlights

Throughout his career, Tanaka has worked with prominent companies such as Aisin Aw Co., Ltd. and Aisin Aw Industries Co., Ltd. His experience in these organizations has allowed him to refine his skills and contribute to innovative projects.

Collaborations

Tanaka has collaborated with talented individuals, including Kazuyoshi Ito and Makoto Nakazuru. These partnerships have enriched his work and fostered a collaborative environment for innovation.

Conclusion

Tanaka Katsunori's contributions to damper device technology highlight his inventive spirit and dedication to engineering. His patent and collaborations reflect a commitment to advancing mechanical solutions.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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