Cupertino, CA, United States of America

Tamayasu Anayama


Average Co-Inventor Count = 4.0

ph-index = 1

Forward Citations = 66(Granted Patents)


Company Filing History:


Years Active: 2010

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1 patent (USPTO):Explore Patents

Title: Tamayasu Anayama: Innovator in Integrated Circuit Repair Technology

Introduction

Tamayasu Anayama is a notable inventor based in Cupertino, CA (US). He has made significant contributions to the field of integrated circuit technology, particularly in the area of defect analysis and repair. His innovative work has led to the development of advanced methods for identifying and correcting defects in integrated circuits.

Latest Patents

Anayama holds a patent for a technology titled "FIB based open via analysis and repair." This patent describes an improved method, apparatus, and control/guiding software designed for localizing, characterizing, and correcting defects in integrated circuits. The focus of this invention is on open or resistive contact/via defects and metal bridging defects, utilizing focused ion beam (FIB) technology. The apparatus includes a focused ion beam system that scans the ion beam over the contact/via to either remove or deposit via material. It also features a detector that collects a secondary particle signal from the contact/via material that is removed. Additional subsystems are included for storing and correlating secondary particle signals, identifying discontinuities, and optimizing the display of these abnormalities.

Career Highlights

Tamayasu Anayama is currently employed at Dcg Systems GmbH, where he continues to advance his research and development efforts in integrated circuit technology. His work has been instrumental in enhancing the reliability and performance of electronic devices.

Collaborations

Anayama has collaborated with notable colleagues such as Theodore R Lundquist and Ketan Shah, contributing to a dynamic and innovative work environment.

Conclusion

Tamayasu Anayama's contributions to integrated circuit repair technology exemplify the impact of innovation in the electronics industry. His patent for FIB based open via analysis and repair showcases his commitment to improving the reliability of integrated circuits.

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