Yokohama, Japan

Takwto Sakurai

This inventor holds 1 USPTO granted patent. Top assignee: Toyo Seikan Kaisha, Ltd.. Active years: 2015.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Takwto Sakurai. Retrieved from https://idiyas.com/inventor/takwto-sakurai

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 4.0

ph-index = 1


Company Filing History:


Years Active: 2015

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1 patent (USPTO):Explore Patents

Title: The Innovations of Takwto Sakurai

Introduction

Takwto Sakurai is a notable inventor based in Yokohama, Japan. He has made significant contributions to the field of packaging technology, particularly through his innovative designs and methods.

Latest Patents

Sakurai holds a patent for a "Plastic pouch and manufacturing method therefor." This invention involves a unique design where at least one of the obverse surface film and reverse surface film is folded back across the entire width of the plastic pouch. The peripheral edge portions of the pouch are heat-sealed, creating a folded-back section that communicates with the body of the pouch. This design enhances the functionality and usability of plastic pouches.

Career Highlights

Sakurai is associated with Toyo Seikan Kaisha, Ltd., a prominent company in the packaging industry. His work there has allowed him to develop and refine his innovative ideas, contributing to advancements in packaging solutions.

Collaborations

Throughout his career, Sakurai has collaborated with talented individuals such as Kazuyuki Kurosawa and Keizou Kanzaki. These collaborations have fostered a creative environment that encourages the development of new ideas and technologies.

Conclusion

Takwto Sakurai's contributions to the field of packaging through his innovative patent demonstrate his commitment to advancing technology. His work continues to influence the industry and inspire future innovations.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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