Takuya Otsuki

Title: Takuya Otsuki: Printed Wiring Board Manufacturing Innovation.

Introduction

Takuya Otsuki is an inventor associated with Ogaki, Japan, and Ibiden Corporation. His patent work addresses manufacturing processes for printed wiring boards, with a focus on laser-formed openings.

Latest Patents

Otsuki is associated with 1 patent, titled “Printed Wiring Board Manufacturing Method and Processing System.” The invention describes preparing an intermediate substrate with an insulating layer, a conductor layer containing circuits, and a resin insulating layer. A laser processing machine receives opening positions and shot counts determined through analysis and classification of the circuits. Power supply and ground circuits are assigned to one category, while signal circuits are assigned to another; openings for the first category use fewer laser shots than those for the second. The machine then forms the openings according to the specified positions and shot counts.

Career Highlights

Otsuki’s listed patent reflects work on adapting laser processing parameters to circuit types during printed wiring board production. He is associated with Ibiden Corporation, a company involved in electronic materials and components.

Collaborations

Katsuo Kawaguchi and Tsutomu Yamauchi are identified as Otsuki’s coworkers. Their names are also associated with the collaborative context of his patent work.

Conclusion

Takuya Otsuki’s patent highlights a manufacturing approach that classifies circuit types and adjusts laser shot counts to form openings in printed wiring boards.