Company Filing History:
Years Active: 2015-2017
Title: Takuya Moriki: Innovator in Semiconductor Technology
Introduction
Takuya Moriki is a prominent inventor based in Yokohama, Japan. He has made significant contributions to the field of semiconductor technology, holding two patents that showcase his innovative approach to device manufacturing.
Latest Patents
Moriki's latest patents focus on semiconductor devices and their manufacturing methods. One of his patents describes a semiconductor device that includes wiring layers formed over a semiconductor wafer, a via-layer between the wiring layers, and conductive films in the wiring layers. The design features a via-plug in the via-layer that connects the conductive films of the wiring layers above and below. Additionally, the patent outlines a scribe region at the outer periphery of a chip region, which includes a pad region that overlaps the conductive films of the wiring layers. This innovative design enhances the functionality and efficiency of semiconductor devices.
Career Highlights
Takuya Moriki is currently employed at Fujitsu Semiconductor Limited, where he continues to develop cutting-edge semiconductor technologies. His work has been instrumental in advancing the capabilities of semiconductor devices, making them more efficient and reliable.
Collaborations
Throughout his career, Moriki has collaborated with notable colleagues, including Kazutaka Yoshizawa and Taiji Ema. These collaborations have contributed to the successful development of innovative semiconductor solutions.
Conclusion
Takuya Moriki is a key figure in the semiconductor industry, with a focus on innovative device manufacturing. His patents reflect his commitment to advancing technology in this critical field.