Nagaokakyo, Japan

Takuya Maekawa

This inventor holds 1 USPTO granted patent. Top assignee: Murata Manufacturing Co., Ltd.. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Takuya Maekawa. Retrieved from https://idiyas.com/inventor/takuya-maekawa-ndw2okw5

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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Average Co-Inventor Count = 1.0


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Takuya Maekawa: Inventor of an Antenna Module

Introduction

Takuya Maekawa is an inventor associated with Nagaokakyo, Japan, and Murata Manufacturing Co., Ltd. His patent work includes an antenna module designed to combine electrical connectivity with heat conduction between circuit boards.

Latest Patents

Maekawa is associated with 1 patent: “Antenna Module and Antenna Component.” The invention describes a first circuit board containing an antenna for transmitting or receiving electromagnetic waves or magnetic fields, and a second circuit board positioned opposite and overlapping the first. An electrically connecting member links the boards. The module also includes a semiconductor integrated circuit covered by a first metal case, with both mounted on one of the boards. A heat-conductive path passes through a solid that includes the metal case, conducting heat between the circuit boards.

Career Highlights

Maekawa’s listed patent reflects work on antenna-module design, circuit-board integration, and thermal management. He is associated with Murata Manufacturing Co., Ltd., a company known for developing electronic components and technologies.

Collaborations

Maekawa’s listed coworker is Hiroyuki Nakaji. Their association provides context for the professional connections surrounding the patent.

Conclusion

Takuya Maekawa’s patent documents an antenna-module design that integrates circuit boards, an antenna, a semiconductor component, and a heat-conductive path.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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