Haibara-gun, Japan

Takuya Kitamura


Average Co-Inventor Count = 3.0

ph-index = 4

Forward Citations = 100(Granted Patents)


Location History:

  • Shizuoka-ken, JP (1996)
  • Shizuoka, JP (1996 - 1998)
  • Haibara-gun, JP (1998 - 2000)

Company Filing History:


Years Active: 1996-2000

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5 patents (USPTO):Explore Patents

Title: Innovations by Takuya Kitamura

Introduction

Takuya Kitamura is a notable inventor based in Haibara-gun, Japan. He has made significant contributions to the field of manufacturing, particularly in the development of waterproof connector housings. With a total of five patents to his name, Kitamura's work showcases his expertise and innovative spirit.

Latest Patents

Among his latest patents is a method of manufacturing a waterproof connector housing. This method enables the formation of a uniform packing ring, which is an integral part of the housing. The process involves engaging a hollow body of the housing with a trapezoidal engaging portion provided on a male mold. The housing is held tightly against the inner wall of the hollow body, aligning the center of the male mold with that of the housing. Rubber material is then injected into a packing ring forming space, which is uniformly defined by either the male or female mold through rubber supply paths of the housing. The design incorporates a hollow body with a tapered shoulder, a male mold with a trapezoidal engaging portion, and a female mold that is beveled or thinned at the open edge.

Career Highlights

Takuya Kitamura is currently employed at Yazaki Corporation, where he continues to innovate and develop new technologies. His work has been instrumental in advancing manufacturing techniques within the company.

Collaborations

Some of his notable coworkers include Masanori Tsuji and Motohisa Kashiyama, who contribute to the collaborative environment at Yazaki Corporation.

Conclusion

Takuya Kitamura's contributions to the field of manufacturing, particularly in waterproof connector housings, highlight his innovative capabilities. His patents reflect a commitment to advancing technology and improving manufacturing processes.

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