Company Filing History:
1 out of 1 
1 out of 481 
Years Active: 2021-2022
Title: Takuto Watanabe: Innovator in Semiconductor Technology
Introduction
Takuto Watanabe is a notable inventor based in Kitaibaraki, Japan. He has made significant contributions to the field of semiconductor technology, holding 2 patents that showcase his innovative approach to manufacturing processes.
Latest Patents
Watanabe's latest patents include a semiconductor substrate and a manufacturing method for it. This invention features a semiconductor substrate with an Au electrode pad, which is enhanced by an electrolessly-plated Ni film, Pd film, or Au film. The manufacturing method involves several steps, including degreasing, etching, pre-dipping, catalyst application, and electroless plating.
Another significant patent is for a semiconductor wafer designed to suppress voids at the interface between a passivation film and an electroless nickel plating film. This wafer ensures that the electrode pad is entirely covered by the electroless nickel plating film, addressing issues related to void formation.
Career Highlights
Watanabe has worked with prominent companies in the semiconductor industry, including JX Nippon Mining & Metals Corporation and JX Nippon Mining Metals Corporation. His experience in these organizations has contributed to his expertise in semiconductor technologies.
Collaborations
Watanabe has collaborated with various professionals in his field, including his coworker Katsuyuki Tsuchida. Their joint efforts have likely led to advancements in semiconductor manufacturing techniques.
Conclusion
Takuto Watanabe's contributions to semiconductor technology through his patents and career experiences highlight his role as an innovator in the industry. His work continues to influence advancements in semiconductor manufacturing processes.