Location History:
- Aichi, JP (1992)
- Obu, JP (1996)
Company Filing History:
Years Active: 1992-1996
Title: Takushi Maeda: Innovator in Semiconductor Technology
Introduction
Takushi Maeda is a prominent inventor based in Aichi, Japan, known for his contributions to semiconductor technology. With a total of 2 patents, he has made significant advancements in the field, particularly in the area of strain sensing.
Latest Patents
One of Maeda's latest patents is a semiconductor device for sensing strain on a substrate. This invention addresses the challenges of stress applied from the substrate side due to temperature changes and defects in wire bonding during the manufacturing process. By utilizing an adhesive for semiconductors that combines resin beads with a flexible base adhesive, this device enhances the reliability of strain sensing.
Another notable patent is for a semiconductor strain sensor and its manufacturing method. This sensor features a stem with a lead hole for a lead terminal, which is electrically connected to an external circuit. The design includes a sensor chip with piezo-resistors joined to a bridge circuit on the stem's front surface. The shell is attached to the stem through projection welding, and the space between them is filled with a damping liquid. This innovative arrangement effectively mitigates the impact of welding strain on the sensor chip.
Career Highlights
Takushi Maeda is currently employed at Nippondenso Co., Ltd., where he continues to develop cutting-edge semiconductor technologies. His work has significantly contributed to advancements in the industry, particularly in improving the performance and reliability of semiconductor devices.
Collaborations
Maeda collaborates with talented coworkers, including Masashi Echigo and Yoshitaka Nagayama, who share his commitment to innovation in semiconductor technology.
Conclusion
Takushi Maeda's contributions to semiconductor technology through his patents demonstrate his expertise and dedication to innovation. His work continues to influence the field, paving the way for future advancements in strain sensing and semiconductor devices.