The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 09, 1996
Filed:
Jul. 29, 1994
Applicant:
Inventors:
Masashi Echigo, Kariya, JP;
Yoshitaka Nagayama, Nukata, JP;
Takushi Maeda, Obu, JP;
Toshitaka Yamada, Okazaki, JP;
Masahiko Kitano, Nukata, JP;
Assignee:
Nippondenso Co., Ltd., Kariya, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L / ; H01L / ; H01L / ;
U.S. Cl.
CPC ...
257783 ; 257782 ; 257792 ; 257795 ;
Abstract
In fixing a sensor element for sensing stress on a substrate by using an adhesive for semiconductors, the present invention aims to solve both the problems of stress applied from the substrate side due to temperature change and defects in wire bonding in the wire bonding process. In a semiconductor device equipped with a sensor element for sensing stress fixed on a substrate, an adhesive for semiconductors is used which is prepared by compounding resin beads made of resin with a base adhesive made of flexible resin.