Company Filing History:
Years Active: 2014
Title: Takuji Sukekawa: Innovator in Reflow Soldering Technology
Introduction
Takuji Sukekawa is a notable inventor based in Obu, Japan. He has made significant contributions to the field of soldering technology, particularly with his innovative reflow soldering system. His work has implications for the electronics manufacturing industry, enhancing the efficiency and effectiveness of soldering processes.
Latest Patents
Takuji Sukekawa holds a patent for a reflow soldering system. This system features a heating oven equipped with a contact heating unit that includes a transport rail and a top heat transfer heater. Additionally, it incorporates a hot gas blowing heating unit. The design allows the transport rail and top heat transfer heater to heat the outer edge of printed circuit boards effectively. The transport rail or top heat transfer heater can move in an up-down direction, enabling them to clamp and heat the outer edge of the printed circuit board.
Career Highlights
Sukekawa is associated with Denso Corporation, a leading company in the automotive components industry. His work at Denso has allowed him to apply his innovative ideas in a practical setting, contributing to advancements in manufacturing processes.
Collaborations
Throughout his career, Takuji Sukekawa has collaborated with talented individuals such as Hiroyuki Yamada and Noriyasu Inomata. These collaborations have fostered a creative environment that encourages innovation and the development of new technologies.
Conclusion
Takuji Sukekawa's contributions to reflow soldering technology exemplify the impact of innovation in manufacturing. His patent and work at Denso Corporation highlight the importance of advancements in the electronics industry. His collaborations further enhance the potential for future innovations in this field.