The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 19, 2014
Filed:
Nov. 05, 2012
Applicant:
Denso Corporation, Kariya, JP;
Inventors:
Assignee:
Denso Corporation, Kariya, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 37/00 (2006.01); B23K 37/04 (2006.01); B23K 31/02 (2006.01); B23K 3/08 (2006.01); B23K 3/00 (2006.01); B23K 3/04 (2006.01); H05K 3/34 (2006.01);
U.S. Cl.
CPC ...
B23K 3/00 (2013.01); H05K 3/3494 (2013.01); B23K 3/08 (2013.01); B23K 3/04 (2013.01);
Abstract
A reflow soldering system wherein a heating oven is provided with a contact heating unit which has a transport rail and a top heat transfer heater, and with a hot gas blowing heating unit, the transport rail and top heat transfer heater are respectively provided with heaters which heat the outer edge part of the printed circuit board, and the transport rail or top heat transfer heater moves in an up-down direction so that the transport rail and top heat transfer heater clamp and heat the outer edge part of the printed circuit board.