This inventor holds 1 USPTO granted patent. Top assignee: Tanaka Kikinzoku Kogyo K.k.. Active years: 2018.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2018
Title: Takuji Iwatani: Innovator in Electronic Component Sealing Technology
Introduction
Takuji Iwatani is a notable inventor based in Hiratsuka, Japan. He has made significant contributions to the field of electronic components, particularly in the area of sealing technologies. His innovative approach has led to the development of a unique sealing cap that enhances the reliability and performance of electronic packages.
Latest Patents
Iwatani holds a patent for a sealing cap designed for electronic components. This invention focuses on producing a package with a sealed region by bonding the cap to a base. The cap features a brazing material-fused surface that is specifically engineered to ensure optimal wettability when the brazing material is fused. The design includes a non-flat work surface formed by plastic working, which allows for various cross-sectional shapes, such as grooves, V shapes, and circular arcs. The innovative ratio of the surface areas of the brazing material-fused surface to the sealing surface ensures effective sealing without excessive spreading of the brazing material during the sealing process.
Career Highlights
Iwatani is currently employed at Tanaka Kikinzoku Kogyo K.K., where he continues to develop and refine technologies related to electronic components. His work has been instrumental in advancing the capabilities of sealing technologies, making them more efficient and reliable for various applications.
Collaborations
Throughout his career, Iwatani has collaborated with talented individuals such as Sadatoshi Sonoda and Kenichi Miyazaki. These collaborations have fostered a creative environment that encourages innovation and the sharing of ideas.
Conclusion
Takuji Iwatani's contributions to the field of electronic component sealing technology exemplify the impact of innovative thinking in engineering. His patented sealing cap represents a significant advancement in ensuring the reliability of electronic packages. Iwatani's work continues to influence the industry and inspire future innovations.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile