Taketoshi Maeda

Title: Taketoshi Maeda: Innovator in Semiconductor Packaging

Introduction

Taketoshi Maeda is a prominent inventor based in Hiroshima, Japan. He has made significant contributions to the field of semiconductor technology, holding 2 patents that showcase his innovative approach to device packaging.

Latest Patents

One of his latest patents focuses on the packaging of a semiconductor device with dual sealing materials. This invention provides a semiconductor device that includes an insulating layer and a conductive layer bonded to one main surface of the insulating layer. A semiconductor element is arranged such that its upper surface faces the same direction as the main surface of the insulating layer. An upper electrode is provided on the upper surface of the semiconductor element, and a wiring member has one end electrically bonded to the upper electrode and another end bonded to the conductive layer. The invention features a hollow portion, a first sealing material that seals part of the semiconductor element, and a second sealing material that seals the wiring member.

Career Highlights

Taketoshi Maeda is currently associated with Mitsubishi Electric Corporation, where he continues to develop innovative solutions in semiconductor technology. His work has been instrumental in advancing the efficiency and reliability of semiconductor devices.

Collaborations

He has collaborated with notable coworkers, including Soichi Sakamoto and Junji Fujino, contributing to a dynamic team focused on innovation.

Conclusion

Taketoshi Maeda's contributions to semiconductor packaging reflect his dedication to innovation and excellence in technology. His patents are a testament to his expertise and commitment to advancing the field.