Ibaraki, Japan

Takeshi Yamato

This inventor holds 3 USPTO granted patents and 1 EPO patent. Top assignee: Nitto-Denko Corporation. Active years: 2002-2012.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Takeshi Yamato. Retrieved from https://idiyas.com/inventor/takeshi-yamato

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 33.3


Average Co-Inventor Count = 2.3

ph-index = 3

Forward Citations = 35(Granted Patents)


Location History:

  • Osaka, JP (2008)
  • Ibaraki, JP (2002 - 2012)

Company Filing History:


Years Active: 2002-2012

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3 patents (USPTO):Explore Patents

Title: Innovations of Takeshi Yamato in Circuit Board Manufacturing

Introduction

Takeshi Yamato is a notable inventor based in Ibaraki, Japan. He has made significant contributions to the field of circuit board manufacturing, holding a total of 3 patents. His work focuses on innovative methods that enhance the efficiency and quality of printed circuit boards.

Latest Patents

One of his latest patents is a method for manufacturing printed circuit boards. This method involves preparing an insulating layer made of an insulator film, followed by the formation of a thin metal film and a thin copper film on the insulating layer. The process includes laminating the thin copper film with a dry film, exposing and developing it to create a plating resist with patterns opposite to the conductor patterns. Subsequently, conductor patterns made of copper are formed through electrolytic plating. The plating resist is then removed, and the thin copper film undergoes thermal treatment at a specified temperature. Finally, chemical etching is used to remove the thin copper film and thin metal film, except for the portions under the conductor patterns.

Another significant patent by Yamato is the producing method of a flexible wired circuit board. This method aims to prevent the formation of gaps between an elongate substrate and a stiffener sheet bonded to it. The process involves forming a conductive pattern on the elongate substrate using a semi-additive process and bonding a stiffener sheet to the back side of the substrate. This innovative approach ensures that etching or developing solutions do not contaminate the flexible wired circuit board.

Career Highlights

Takeshi Yamato is currently employed at Nitto Denko Corporation, where he continues to develop and refine his innovative techniques in circuit board manufacturing. His work has been instrumental in advancing the technology used in this field.

Collaborations

Yamato collaborates with talented individuals such as Kenichiro Ito and Toshiki Naito, contributing to a dynamic and innovative work environment.

Conclusion

Takeshi Yamato's contributions to circuit board manufacturing through his innovative patents demonstrate his expertise and commitment to advancing technology in this field. His work continues to influence the industry positively.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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