Shizuoka, Japan

Takeshi Nishigaya


Average Co-Inventor Count = 3.3

ph-index = 6

Forward Citations = 96(Granted Patents)


Company Filing History:


Years Active: 1995-2001

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18 patents (USPTO):Explore Patents

Title: The Innovations of Takeshi Nishigaya: Pioneering Adhesive Solutions

Introduction: Takeshi Nishigaya is a notable inventor based in Shizuoka, Japan. With an impressive portfolio of 18 patents, Nishigaya has significantly contributed to the field of adhesive technologies, particularly for electronic components. His inventive spirit and dedication to innovation have earned him recognition in the industry.

Latest Patents: Among Nishigaya's latest patents is a groundbreaking adhesive tape designed specifically for electronic parts. This innovative adhesive tape features a heat-resisting film coupled with an adhesive layer. The adhesive composition includes a polyimide that contains unique repeating units, ensuring optimal thermal resistance and reliability. Another notable patent involves a dual-layer adhesive tape which comprises a metal substrate along with two distinct adhesive layers, each having varying glass transition temperatures. This design aims to provide enhanced performance in electronic applications, demonstrating Nishigaya's commitment to advancing adhesive technology.

Career Highlights: Nishigaya’s professional journey is marked by his tenure at Tomoegawa Paper Co., Inc., where he has spearheaded numerous projects focused on creating cutting-edge adhesive solutions. His expertise in material science and adhesive applications has established him as a thought leader within his company and the broader industry.

Collaborations: Nishigaya has collaborated with esteemed colleagues such as Fumiyoshi Yamanashi and Osamu Oka. Together, they have worked on various projects that harness their collective knowledge and skills, furthering advancements in adhesive technology and materials for electronics.

Conclusion: Through his innovative contributions and collaborative efforts, Takeshi Nishigaya continues to shape the future of adhesive applications, particularly in the electronics sector. His developments not only enhance product performance but also inspire future inventions, solidifying his role as a leading inventor in the field.

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