This inventor holds 2 USPTO granted patents and 1 EPO patent. Top assignee: Omron Corporation. Active years: 2000-2005.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Location History:
- Kyoto, JP (2000)
- Takatsuki, JP (2005)
Company Filing History:
Years Active: 2000-2005
Title: The Innovations of Takeshi Nakata
Introduction
Takeshi Nakata is a notable inventor based in Takatsuki, Japan. He has made significant contributions to the field of technology, particularly in the area of printed board packaging. With a total of 2 patents to his name, Nakata's work has had a meaningful impact on the industry.
Latest Patents
One of Nakata's latest patents is a method of providing a program for a printed board packaging line. This innovative method involves a board packaging line coordinating computer that downloads service contract information and application programs from an application server. The system defines the board packaging line covered by the program and the device configuration of the line. The defined device configuration is then uploaded to the application server, which searches for the required device driver from a prepared device driver group. This driver is subsequently downloaded and set in each device by the coordinating computer.
Career Highlights
Takeshi Nakata is currently employed at Omron Corporation, a leading company in automation and control technology. His work at Omron has allowed him to develop and refine his innovative ideas, contributing to the advancement of technology in his field.
Collaborations
Nakata has collaborated with several talented individuals throughout his career, including Katsuhiko Ichimura and Hiroshi Yoshida. These collaborations have fostered a creative environment that has led to the development of groundbreaking technologies.
Conclusion
Takeshi Nakata's contributions to the field of technology through his patents and work at Omron Corporation highlight his role as an influential inventor. His innovative methods continue to shape the future of printed board packaging technology.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
