Takeshi Kodai

Title: Innovations by Takeshi Kodai in Thermoforming Technology

Introduction

Takeshi Kodai is a notable inventor based in Hannan, Japan. He has made significant contributions to the field of packaging technology, particularly in the area of thermoforming. His innovative approach has led to advancements that enhance the efficiency and effectiveness of blister packing machines.

Latest Patents

Takeshi Kodai holds a patent for a "Thermoforming method for film on blister packing machines and apparatus for it." This invention provides a thermoforming system that forms pockets without extreme reduction of thickness at the top face portion of the pocket. It enables sheets to be placed one upon another without warping. The system pinches and heats a film, fed intermittently in synchronization with the open/close drive of a pair of dies, between the dies of the thermoforming system. It partially extends the heated film along the inner circumferential face of the pocket holes of the forming die to create pockets. The design includes a forming die with pocket holes, a heating die with plugs for localized heating, and injecting mechanisms that utilize compressed air.

Career Highlights

Takeshi Kodai is associated with Mutual Corporation, where he continues to develop and refine his innovative ideas. His work has been instrumental in improving the functionality and reliability of blister packing machines, making them more efficient for various applications.

Conclusion

Takeshi Kodai's contributions to thermoforming technology exemplify the impact of innovation in the packaging industry. His patent reflects a commitment to enhancing manufacturing processes and improving product quality.