The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 15, 2004

Filed:

Aug. 30, 2002
Applicant:
Inventor:

Takeshi Kodai, Hannan, JP;

Assignee:

Mutual Corporation, Osaka, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B65B 4/700 ;
U.S. Cl.
CPC ...
B65B 4/700 ;
Abstract

The present provides a thermoforming system for film on blister packing machines that forms pockets without any extreme reduction of thickness of the sheet at the top face portion of the pocket and enables sheets to be placed one upon another without warping. The thermoforming system for film for blister packaging machines pinches and heats a film, fed intermittently in synchronization with an open/close drive of a pair of dies on a thermoforming system, between the dies of the thermoforming system, and partially extends the heated film along an inner circumferential face of the pocket holes of the forming die to form pockets. The dies of the thermoforming system are constructed with a forming die provided with pocket holes, a heating die provided with a plugs for locally heating only the pocket forming portion of the film F disposed facing the pocket holes of the forming die, and injecting mechanisms that inject compressed air disposed on the forming die side and the heating die side, respectively.


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