Kamakura, Japan

Takeshi Chida


Average Co-Inventor Count = 3.6

ph-index = 3

Forward Citations = 25(Granted Patents)


Location History:

  • Kamakura, JP (1983 - 1987)
  • Kokubunji, JP (1991)

Company Filing History:


Years Active: 1983-1991

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4 patents (USPTO):Explore Patents

Title: The Innovations of Takeshi Chida

Introduction

Takeshi Chida is a prominent inventor based in Kamakura, Japan. He has made significant contributions to the field of polymer chemistry, particularly in the development of novel rubbery copolymers. With a total of 4 patents to his name, Chida's work has had a substantial impact on various industrial applications.

Latest Patents

Chida's latest patents include a groundbreaking rubbery copolymer and a rubber composition for dust cover boots. The first patent describes a novel rubbery copolymer that comprises structural units based on 1,1-dicyano-2-vinylcyclopropane and 1,1-difluoro-2-vinylcyclopropane. This copolymer exhibits exceptional properties, including improved oil resistance, cold resistance, thermal resistance, and resistance to various types of gasoline. The second patent focuses on a rubber composition specifically designed for dust cover boots, which includes a copolymer rubber made from epichlorohydrin and propylene oxide.

Career Highlights

Chida is currently employed at Nippon Zeon Company, Ltd., where he continues to innovate in the field of rubber and polymer materials. His work has not only advanced the understanding of copolymerization but has also led to practical applications in various industries.

Collaborations

Throughout his career, Chida has collaborated with notable colleagues such as Akio Ueda and Shuichi Akita. These collaborations have fostered a creative environment that has led to the development of innovative materials and processes.

Conclusion

Takeshi Chida's contributions to polymer chemistry and his innovative patents highlight his role as a leading inventor in the field. His work continues to influence the development of advanced materials that meet the demands of modern applications.

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