Location History:
- Nagoya, JP (2006)
- Tsuchiura, JP (2010 - 2012)
- Tsukuba, JP (2012)
Company Filing History:
Years Active: 2006-2012
Title: Takemi Muroga: Innovator in Rolled Copper Foil Technology
Introduction
Takemi Muroga is a notable inventor based in Tsuchiura, Japan. He has made significant contributions to the field of materials science, particularly in the development of rolled copper foil technology. With a total of 5 patents to his name, Muroga's work has had a considerable impact on various industries.
Latest Patents
Muroga's latest patents focus on innovative designs for rolled copper foil. One of his patents describes a rolled copper foil that consists of at least either silicon (Si) and iron (Fe), boron (B), silver (Ag), and oxygen (O) at a mass percentage of 0.002 or less, with the balance being copper (Cu) and inevitable impurities. Another patent details a rolled copper foil that includes a specific crystal grain alignment. This alignment is characterized by a normalized intensity of {200} plane diffraction of a copper crystal, which is measured through X-ray diffraction pole figure analysis. The ratio of maximum values of normalized intensity at different angles is a key feature of this invention.
Career Highlights
Throughout his career, Takemi Muroga has worked with prominent companies such as Hitachi Cable, Inc. and Toshiba Corporation. His experience in these organizations has allowed him to refine his expertise in materials and contribute to groundbreaking innovations.
Collaborations
Muroga has collaborated with notable colleagues in his field, including Yoshiki Yamamoto and Yasuyuki Ito. These partnerships have fostered a collaborative environment that has led to advancements in technology and innovation.
Conclusion
Takemi Muroga's contributions to rolled copper foil technology exemplify his dedication to innovation and excellence in materials science. His patents and collaborations reflect a commitment to advancing the industry and enhancing the performance of materials used in various applications.