Hitachi Cable, Inc.

Kabushiki Kaisha Toshiba

International Superconductivity Technology Center

Chubu Electric Power Company, Inc.

Takemi Muroga

Yutaka Yamada

Yoshiki Yamamoto

Kenji Yokomizo

Noboru Hagiwara

Yasuyuki Ito

Koji Aoyagi

Takeshi Araki

Izumi Hirabayashi

Katsumi Nomura

Satoshi Seki

Toshiharu Niwa

Takeshi 406 Toshiba Oojima Apartment Araki

A rolled copper foil consisted of at least either of silicon (Si) and iron (Fe), boron (B), silver (Ag), oxygen (O) of 0.002 mass % or less, and a balance consisted of copper (Cu) and inevitable impurities.

Rolled copper foil

A rolled copper foil according to the present invention includes a crystal grain alignment wherein: when normalized intensity of {200}plane diffraction of a copper crystal in results obtained by an X-ray diffraction pole figure measurement with respect to a rolled surface is plotted against at different values of angle &#x3b1;, the normalized intensity being obtained during a &#x3b2; scanning in the pole figure measurement, a ratio of a maximum value A of the normalized intensity with angle &#x3b1; in a range of 40&#xb0; to 60&#xb0; to a maximum value B of the normalized intensity with angle &#x3b1; in a range of 80&#xb0; to 90&#xb0; is equal to or greater than 4; and when the normalized intensity increases with increasing angle &#x3b1; in a range of 25&#xb0; to 45&#xb0;, there is essentially no area in which the normalized intensity increases stepwise.

A copper alloy material has a rolled surface having a plurality of crystal faces parallel to the rolled surface. The crystal faces includes at least one crystal face selected from a group consisted of {011}, {1nn} (n is an integer, n&#x2267;1), {11m} (m is an integer, m&#x2267;1), {023}, {012}, and {135}. Diffraction intensities of the crystal faces in an inverse pole figure obtained by crystal diffraction measurement of the rolled surface as a reference satisfy the relationships of:{011}&#x3e;{155}&#x3e;{133},{011}&#x3e;{023}&#x3e;{012}, and{011}&#x3e;{135}&#x3e;{112}.

Copper alloy material and a method for fabricating the same

A rolled copper foil applied with a recrystallization annealing after a final cold rolling step and having a crystal grain alignment satisfying a ratio of [a]/[b]&#x2267;3, where [a] and [b] are normalized average intensities of a {111}plane diffraction of a copper crystal by &#x3b2;-scanning at &#x3b1;=35&#xb0; and 74&#xb0;, respectively, in an X-ray diffraction pole figure measurement to a rolled surface is manufactured by controlling a total working ratio in the final cold rolling step before the recrystallization annealing to be 94% or more; and controlling a working ratio per one pass in the final cold rolling step to be 15 to 50%.

Rolled copper foil and manufacturing method thereof

There is provided is a method of manufacturing a superconductor layer, including preparing a coating solution by dissolving trifluoroacetates of at least one metal selected from the group consisting of yttrium and lanthanoids, barium, and copper in a solvent, coating a main surface of a substrate with the coating solution to form a coating film, subjecting the coating film to a calcining process in an atmosphere containing oxygen, and subjecting the coating film after the calcining process to a firing process in an atmosphere containing water vapor at a temperature higher than that at the calcining process. The calcining process is carried out such that the coating film after the calcining process and before the firing process have an average CuO particle diameter equal to or less than 25 nm.

Superconductor layer and method of manufacturing the same

Growing community of inventors

Tsuchiura, Japan

Takemi Muroga