Takeharu Matsuda

Title: Takeharu Matsuda: Innovator in Cutting Technology

Introduction

Takeharu Matsuda is a notable inventor based in Nara-ken, Japan. He has made significant contributions to the field of cutting technology, particularly through his innovative patent related to wire saw cutting methods. His work has implications for enhancing the efficiency and effectiveness of wafer cutting processes.

Latest Patents

Matsuda holds a patent for a cutting method by wire saw and cut workpiece receiving member in wire saw. This method involves a wire array wound around work rollers, which is made to reciprocate or travel in one direction at high speed. Numerous pieces of wafers are cut out by abutting a workpiece against the wire array. A cassette-type receiving member with support wires arranged at the same pitch as the wire array is positioned immediately under the wire array. This design prevents the wafers from adhering to each other during the cutting operation, ensuring accurate cuts and reducing the risk of cracking. Consequently, the wafers can be efficiently separated, enhancing wafer cleansing performance.

Career Highlights

Takeharu Matsuda is associated with Takatori Corporation, where he applies his expertise in cutting technologies. His innovative approach has positioned him as a key figure in the development of advanced cutting methods that improve production efficiency in the semiconductor industry.

Collaborations

Due to space limitations, the collaborations section will be omitted.

Conclusion

Takeharu Matsuda's contributions to cutting technology through his innovative patent demonstrate his commitment to enhancing manufacturing processes. His work continues to influence the industry, particularly in wafer production.