Kashiwa, Japan

Takayuki Ueki

This inventor holds 1 USPTO granted patent. Top assignee: Dai Nippon Printing Co., Ltd.. Active years: 2016.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Takayuki Ueki. Retrieved from https://idiyas.com/inventor/takayuki-ueki-redcq4nf

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

Average Co-Inventor Count = 4.0

ph-index = 1

Forward Citations = 16(Granted Patents)


Company Filing History:


Years Active: 2016

Loading Chart...
1 patent (USPTO):Explore Patents

Title: Takayuki Ueki: Innovator in Adhesive Technology

Introduction

Takayuki Ueki is a notable inventor based in Kashiwa, Japan. He has made significant contributions to the field of adhesive technology, particularly with his innovative adhesive sheet design. His work has implications for various industries, including manufacturing and materials science.

Latest Patents

Ueki holds a patent for an "Adhesive sheet and bonding method using the same." This adhesive sheet is designed to have initial adhesiveness and can bond metals, as well as organic materials, while maintaining excellent adhesion strength without temperature changes. The adhesive sheet consists of a first release paper, an adhesive layer, and a second release paper. The adhesive layer contains a mixture of an acrylic resin, an epoxy resin, and a curing agent, with specific proportions to ensure optimal performance.

Career Highlights

Ueki is associated with Dai Nippon Printing Co., Ltd., where he has been able to apply his expertise in adhesive technology. His work has contributed to advancements in bonding methods that are crucial for various applications.

Collaborations

Ueki has collaborated with notable colleagues, including Kentaro Hoshi and Junichi Kuroki. These collaborations have likely enhanced the development and refinement of his adhesive technologies.

Conclusion

Takayuki Ueki's innovative work in adhesive technology exemplifies the importance of research and development in creating effective bonding solutions. His contributions continue to influence the industry and pave the way for future advancements.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Loading…