Tokyo, Japan

Takayoshi Takushima

This inventor holds 1 USPTO granted patent and 1 published patent application. Top assignee: Sumco Corporation. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Takayoshi Takushima. Retrieved from https://idiyas.com/inventor/takayoshi-takushima

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 1 

Average Co-Inventor Count = 1.0

ph-index = 1


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Takayoshi Takushima and a Safer Substrate Transfer System.

Introduction

Takayoshi Takushima is an inventor associated with Sumco Corporation in Tokyo, Japan. His patent work addresses a practical challenge in substrate handling: preventing scratches on a substrate’s mirror-like main surface during transfer.

Latest Patents

Takushima is associated with 1 patent, titled “Substrate Transfer System.” The invention describes a transfer section that moves a substrate relative to a system component, while an imaging section captures both the component’s mirror image reflected on the substrate and its real image. A judgment section analyzes these images to determine whether the clearance between the substrate and the component is abnormal. This approach is designed to help prevent contact that could damage the substrate’s polished surface.

Career Highlights

Takushima’s listed patent highlights his contribution to substrate-transfer technology and surface protection. The system uses image-based inspection to assess clearance during movement, helping identify potential contact risks.

Collaborations

Takushima is associated with Sumco Corporation. Kento Maruyama is identified as a coworker.

Conclusion

Takayoshi Takushima’s substrate transfer system applies imaging and clearance assessment to help protect delicate substrate surfaces during handling.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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