Tokyo, Japan

Takashi Oyamada

This inventor holds 27 USPTO granted patents and 1 published patent application, primarily in Heat Management Technology. Top assignees: Nec Corporation, Tamura Electric Works, Ltd., Nippon Electric Co., Ltd.. Active years: 1978-2008.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Takashi Oyamada. Retrieved from https://idiyas.com/inventor/takashi-oyamada

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 27 

% Patents Active = 77.8

Average Co-Inventor Count = 1.4

ph-index = 16

Forward Citations = 647(Granted Patents)


Location History:

  • Kanagawa, JP (1987)
  • Minato-ku, JP (2006)
  • Tokyo, JP (1978 - 2008)

Company Filing History:


Years Active: 1978-2008

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Areas of Expertise:
Heat Radiation
Electronic Card Unit
Telecommunication Device
Heat Conductivity
Modular Connector
Portable Communication
Casing Structure
Water-Proof Design
Digital Display Pager
Radio Receiver
Mount Structure
Paging Receiver
27 patents (USPTO):Explore Patents

Title: Innovations by Takashi Oyamada in Electronic Cooling Technologies

Introduction

Takashi Oyamada is a prominent inventor based in Tokyo, Japan, with an impressive portfolio of 27 patents. He has made significant contributions to the field of electronic device cooling, enhancing the efficiency and safety of various electronic components. His work not only demonstrates technical ingenuity but also addresses critical challenges in heat management in electronic systems.

Latest Patents

Two of his latest patents are particularly noteworthy. The first is an 'Electronic Card Unit and Method for Removing Heat from a Heat-Generating Component on a Printed Circuit Board.' This invention features a heat-radiating structure that is compact, reinforcing the printed circuit board while improving heat radiation efficiency. The dual-function reinforcing plates and heat dissipaters are located at the upper and lower edges of the printed circuit board, allowing heat generated by components to be efficiently removed. The design employs a fluid within a heat pipe or a heat radiation circulation pipe to enhance heat dissipation into the air.

The second patent, 'Housing Structure of Electronic Device and Heat Radiation Method Therefor,' involves a sealed housing designed with a body, a cover, and a movable fin to radiate heat while minimizing changes in internal pressure and preventing the entrance of water vapor or toxic gases. This design is crucial for safety, as it avoids the risk of dew condensation and corrosion of electrical components. The innovative movable fin adjusts according to internal atmospheric pressure changes, thus optimizing the heat radiation area when necessary.

Career Highlights

Takashi Oyamada has had a distinguished career, working with notable companies such as NEC Corporation and Tamura Electric Works, Ltd. His roles in these organizations have allowed him to develop innovative cooling solutions that meet the evolving needs of electronic technology.

Collaborations

Throughout his career, Oyamada has collaborated with talented individuals, including coworkers Sigeki Hayasaka and Osamu Kai. These professional relationships have fostered an environment of creativity and innovation, further advancing developments in electronic device technology.

Conclusion

Takashi Oyamada exemplifies the spirit of innovation in the field of electronic cooling technology. His latest patents not only reflect his technical expertise but also contribute significantly to improving the reliability and performance of electronic devices. As technology continues to evolve, Oyamada’s work remains vital in shaping the future of heat management solutions in electronics.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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