Chiba, Japan

Takashi Kojima

This inventor holds 1 USPTO granted patent. Top assignee: Powdertech Corporation. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Takashi Kojima. Retrieved from https://idiyas.com/inventor/takashi-kojima-arafp8ha

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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Average Co-Inventor Count = 1.0


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: The Innovations of Takashi Kojima

Introduction

Takashi Kojima is a notable inventor based in Chiba, Japan. He has made significant contributions to the field of materials science, particularly in the development of advanced ferrite materials. His work has implications for various electronic applications, showcasing his expertise and innovative spirit.

Latest Patents

Kojima holds a patent for a ferrite powder, ferrite resin composite material, and electromagnetic shielding material. This invention provides a ferrite powder that suppresses the dropping out of ferrite particles when applied in a composite material, without compromising moldability and filling ability. The ferrite powder includes spherical or polyhedral ferrite particles with a step structure on their surfaces, enhancing their performance in electronic components.

Career Highlights

Kojima is associated with Powdertech Corporation, where he continues to push the boundaries of material innovation. His work has been instrumental in advancing the capabilities of electronic materials, making them more efficient and reliable.

Collaborations

Some of his notable coworkers include Koji Aga and Takao Sugiura, who contribute to the collaborative environment at Powdertech Corporation. Their combined expertise fosters innovation and drives the development of cutting-edge materials.

Conclusion

Takashi Kojima's contributions to the field of ferrite materials exemplify the impact of innovative thinking in technology. His patent reflects a commitment to enhancing electronic components, paving the way for future advancements in the industry.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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