Kanagawa, Japan

Takashi Kayama


Average Co-Inventor Count = 4.6

ph-index = 2

Forward Citations = 222(Granted Patents)


Location History:

  • Yokohama, JP (1981)
  • Kanagawa, JP (1997 - 2002)

Company Filing History:


Years Active: 1981-2002

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3 patents (USPTO):Explore Patents

Title: The Innovative Journey of Takashi Kayama

Introduction

Takashi Kayama, located in Kanagawa, Japan, is a renowned inventor with a remarkable portfolio of three patents. His work primarily focuses on advancements in materials applicable to electronics and flexible laminates, showcasing his dedication to innovation in the field.

Latest Patents

Among his notable patents, the "Flexible Metal-Clad Laminates and Preparation of the Same" stands out. This invention describes a flexible metal foil laminate sheet which features a polyimide layer with a unique three-layer structure, enabling enhanced performance characteristics. The process involves heating and pressing metal foil layers against the polyimide laminate, ensuring a strong adhesive force at the interface between the metal and insulating layers. This laminate demonstrates outstanding heat resistance, chemical resistance, and electrical properties. Another significant patent is the "Solid Printed Substrate and Electronic Circuit Package Using the Same," which further exemplifies his innovative contributions to electronic materials.

Career Highlights

Throughout his career, Takashi Kayama has collaborated with several prestigious organizations. Notably, he has worked with Mitsui Toatsu Chemicals, Incorporated, and Mitsui Chemicals, Inc., where he contributed to various innovative projects and product developments.

Collaborations

Takashi's collaborative efforts include working alongside esteemed colleagues such as Kunio Nishihara and Youichi Hosono. Their teamwork has not only fostered a dynamic work environment but also led to significant advancements in technology and materials through joint efforts.

Conclusion

In conclusion, Takashi Kayama's inventive spirit and dedication to research have positioned him as a significant figure in the realm of materials science and electronics. His patents and collaborative projects continue to influence the industry, paving the way for future innovations.

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