Takashi Hokazono

Title: Takashi Hokazono: Innovator in Artificially Patinated Copper Materials

Introduction

Takashi Hokazono is a notable inventor based in Osaka-fu, Japan. He has made significant contributions to the field of materials science, particularly in the development of artificially patinated copper materials. His innovative approach has led to advancements that enhance the aesthetic and functional properties of copper.

Latest Patents

Hokazono holds a patent for an artificially patinated copper material. This invention involves a copper sulfide layer formed on the surface of a copper base plate through a sulfiding process. The copper sulfide layer is then coated with an artificially patinated layer created by spraying a resin solution mixed with basic copper carbonate. The optimal area coverage of the artificially patinated layer on the copper sulfide layer is between 25% to 80%, with a preferred thickness of the copper sulfide layer ranging from 0.1 to 0.5 micrometers.

Career Highlights

Hokazono is associated with Sambo Copper Alloy Co., Ltd., where he has been instrumental in advancing the company's research and development efforts. His work has not only contributed to the company's portfolio but has also positioned it as a leader in innovative copper materials.

Collaborations

Hokazono collaborates with Shinji Tanaka, a fellow innovator in the field. Their partnership has fostered a creative environment that encourages the exploration of new ideas and technologies in materials science.

Conclusion

Takashi Hokazono's contributions to the field of artificially patinated copper materials exemplify the spirit of innovation. His patent reflects a blend of scientific knowledge and practical application, showcasing the potential for advancements in material technology.