Kawaguchi, Japan

Takao Honma

This inventor holds 1 USPTO granted patent. Top assignee: Dic Corporation. Active years: 2013.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Takao Honma. Retrieved from https://idiyas.com/inventor/takao-honma

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 2.0

ph-index = 1

Forward Citations = 3(Granted Patents)


Company Filing History:


Years Active: 2013

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1 patent (USPTO):Explore Patents

Title: Takao Honma: Innovator in Laminate Technology

Introduction

Takao Honma is a notable inventor based in Kawaguchi, Japan. He has made significant contributions to the field of laminate technology, particularly in the development of primers for packaging applications. His innovative work focuses on enhancing the properties of laminates to improve their performance in various conditions.

Latest Patents

Honma holds a patent for a primer and laminate that includes a resin coating film. This invention provides a primer for a laminate used in packaging, which boasts excellent print suitability. The primer is designed to enhance transfer properties of printing ink and dot reproducibility. It also features high adhesive properties, excellent storage stability under humid conditions, and acid resistance. The primer contains a main component that includes a copolymer with specific unsaturated compounds, a curing agent with an isocyanate group, and a compound with carboxylic acid groups.

Career Highlights

Takao Honma is associated with Dic Corporation, where he continues to work on innovative solutions in laminate technology. His expertise and dedication to research have led to advancements that benefit the packaging industry.

Collaborations

Honma collaborates with Hiroyuki Kagaya, contributing to the development of new technologies and enhancing the capabilities of their projects.

Conclusion

Takao Honma's contributions to laminate technology through his innovative patents demonstrate his commitment to improving packaging solutions. His work continues to influence the industry positively.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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