Takao Haranosono

Title: Takao Haranosono: Innovator in Semiconductor Technology

Introduction

Takao Haranosono is a notable inventor based in Satsuma-gun, Japan. He has made significant contributions to the field of semiconductor technology, holding a total of 3 patents. His work focuses on improving the efficiency and reliability of semiconductor devices.

Latest Patents

Haranosono's latest patents include innovative designs for chip-on-chip type semiconductor devices. One of his patents describes a semiconductor device that prevents displacement of semiconductor chips during the transfer molding process, thereby eliminating the risk of short circuits. This design incorporates at least two lead frames that extend from the package, allowing for electrical connections to external devices. Additionally, a die stage is positioned between the first and second semiconductor chips, with bonding wires facilitating connections to the lead frames. Another patent further explores the configuration of lead frames, which may include portions extending perpendicularly between the semiconductor chips.

Career Highlights

Throughout his career, Takao Haranosono has worked with prominent companies in the technology sector, including Fujitsu Corporation and Kyushu Fujitsu Electronics Limited. His experience in these organizations has contributed to his expertise in semiconductor innovations.

Collaborations

Haranosono has collaborated with various professionals in the field, including his coworker, Tosiyuki Honda. Their joint efforts have likely fostered advancements in semiconductor technology.

Conclusion

Takao Haranosono's contributions to semiconductor technology through his patents and career experiences highlight his role as an influential inventor. His innovative designs continue to impact the industry positively.