Company Filing History:
Years Active: 2024
Title: Takao Arima: Innovator in Flexible Laminated Technology
Introduction
Takao Arima is a prominent inventor based in Tokyo, Japan. He is known for his innovative contributions to the field of flexible laminated technology. His work has significantly impacted the development of multilayer circuit boards, showcasing his expertise and creativity in engineering.
Latest Patents
Takao Arima holds a patent for a flexible laminated board and multilayer circuit board. This patent describes a flexible laminated sheet manufacturing method that includes thermocompression-bonding an insulation film formed of a liquid crystal polymer onto a metal foil between endless belts. The process involves heating the flexible laminated sheet to a temperature range that is 45° C. lower than the melting point of the liquid crystal polymer to 5° C. lower than the melting point. Additionally, the method includes slowly cooling the flexible laminated sheet to ensure optimal performance and durability.
Career Highlights
Arima is associated with Ube Exsymo Co., Ltd., where he has made significant contributions to the company's research and development efforts. His innovative approach has led to advancements in flexible laminated technology, making him a valuable asset to the organization.
Collaborations
Throughout his career, Takao Arima has collaborated with notable colleagues, including Eisuke Tachibana and Taro Suzuki. These partnerships have fostered a creative environment that encourages innovation and the sharing of ideas.
Conclusion
Takao Arima's work in flexible laminated technology exemplifies the spirit of innovation. His contributions continue to influence the industry, and his patent reflects his commitment to advancing technology.