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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11985762 B1

PDFFull Text
Date of Patent:
May. 14, 2024

Filed:

Jan. 25, 2021

Flexible laminated board and multilayer circuit board

Applicant:

Ube Exsymo Co., Ltd., Tokyo, JP;

Inventors:

Eisuke Tachibana, Tokyo, JP;

Taro Suzuki, Tokyo, JP;

Makoto Totani, Kariya, JP;

Kouji Kondoh, Kariya, JP;

Eijirou Miyagawa, Kariya, JP;

Junya Kasahara, Tokyo, JP;

Takao Arima, Tokyo, JP;

Assignee:

UBE EXSYMO CO., LTD., Tokyo, JP;

Attorneys:

J. Miguel Hernandez

James R. Gourley

Carstens, Allen & Gourley, LLP

Primary Examiner:

Cynthia L Schaller

Int. Cl.
CPC ...
B32B 15/08 (2006.01); B29C 43/48 (2006.01); B29C 48/88 (2019.01); B32B 3/08 (2006.01); B32B 7/04 (2019.01); B32B 7/06 (2019.01); B32B 15/088 (2006.01); B32B 15/09 (2006.01); B32B 15/098 (2006.01); B32B 15/18 (2006.01); B32B 15/20 (2006.01); B32B 27/28 (2006.01); B32B 27/36 (2006.01); B32B 27/42 (2006.01); B32B 37/06 (2006.01); B32B 37/08 (2006.01); B32B 37/10 (2006.01); H05K 1/03 (2006.01); H05K 1/09 (2006.01); H05K 1/11 (2006.01); H05K 3/02 (2006.01); H05K 3/46 (2006.01); B65G 15/12 (2006.01); H05K 3/06 (2006.01); H05K 3/22 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0393 (2013.01); B29C 48/9145 (2019.02); B32B 3/08 (2013.01); B32B 7/04 (2013.01); B32B 7/06 (2013.01); B32B 15/08 (2013.01); B32B 15/088 (2013.01); B32B 15/09 (2013.01); B32B 15/098 (2013.01); B32B 15/18 (2013.01); B32B 15/20 (2013.01); B32B 27/28 (2013.01); B32B 27/281 (2013.01); B32B 27/283 (2013.01); B32B 27/36 (2013.01); B32B 27/42 (2013.01); B32B 37/06 (2013.01); B32B 37/08 (2013.01); B32B 37/10 (2013.01); B32B 37/1027 (2013.01); H05K 1/09 (2013.01); H05K 1/115 (2013.01); H05K 3/022 (2013.01); H05K 3/4655 (2013.01); B29C 43/48 (2013.01); B32B 2250/02 (2013.01); B32B 2250/03 (2013.01); B32B 2250/40 (2013.01); B32B 2307/30 (2013.01); B32B 2307/302 (2013.01); B32B 2307/306 (2013.01); B32B 2307/50 (2013.01); B32B 2307/538 (2013.01); B32B 2307/546 (2013.01); B32B 2307/732 (2013.01); B32B 2307/734 (2013.01); B32B 2307/748 (2013.01); B32B 2309/02 (2013.01); B32B 2309/04 (2013.01); B32B 2405/00 (2013.01); B32B 2457/08 (2013.01); B32B 2457/20 (2013.01); B65G 15/12 (2013.01); H05K 3/067 (2013.01); H05K 3/227 (2013.01); H05K 2201/0141 (2013.01); H05K 2201/0191 (2013.01); H05K 2201/068 (2013.01); H05K 2203/066 (2013.01); H05K 2203/1194 (2013.01); H05K 2203/1545 (2013.01);
Abstract

A flexible laminated sheet manufacturing method includes thermocompression-bonding an insulation film formed of a liquid crystal polymer onto a metal foil between endless belts to form a flexible laminated sheet. The thermocompression bonding includes heating the flexible laminated sheet so that the maximum temperature of the sheet is in the range from a temperature that is 45° C. lower than the melting point of the liquid crystal polymer to a temperature that is 5° C. lower than the melting point. The thermocompression bonding also includes slowly cooling the flexible laminated sheet so that an exit temperature, which is a temperature of the sheet when transferred out of the endless belts, is in the range from a temperature that is 235° C. lower than the melting point of the liquid crystal polymer to a temperature that is 100° C. lower than the melting point.

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