Tokyo, Japan

Takanobu Yoshimi


Average Co-Inventor Count = 3.1

ph-index = 8

Forward Citations = 127(Granted Patents)


Location History:

  • Koto-ku, JP (2006)
  • Tochigi, JP (2009 - 2010)
  • Tokyo, JP (2002 - 2017)

Company Filing History:


Years Active: 2002-2017

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11 patents (USPTO):Explore Patents

Title: Takanobu Yoshimi: Innovator in Connector Technology

Introduction

Takanobu Yoshimi is a prominent inventor based in Tokyo, Japan. He has made significant contributions to the field of connector technology, holding a total of 11 patents. His innovative designs have advanced the functionality and efficiency of various electronic connections.

Latest Patents

One of Yoshimi's latest patents is a contact having two contact portions with their central lines in one plane. This contact is designed to be retained and arranged in an insulating object. It features a contact portion that comes into contact with a counterpart object, a connecting portion for connection, and a main body portion with a U-shaped cross-section. The design includes first and second contact pieces that extend along the direction of mating with a counterpart object, each having a curved shape for optimal contact. Another notable patent is a connector that is detachably fitted with connecting objects such as flexible printed circuit boards or flexible flat cables. This connector includes multiple contacts, a housing for arranging the contacts, and a pivoting member that enhances usability.

Career Highlights

Yoshimi works at DDK Ltd., where he has been instrumental in developing innovative connector solutions. His work has not only improved existing technologies but has also paved the way for new applications in the electronics industry.

Collaborations

Yoshimi collaborates with talented coworkers, including Takeki Fukazawa and Masato Hida. Their combined expertise fosters a creative environment that drives innovation within the company.

Conclusion

Takanobu Yoshimi's contributions to connector technology exemplify the spirit of innovation. His patents reflect a deep understanding of engineering principles and a commitment to enhancing electronic connectivity.

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