Fuji, Japan

Takanobu Teraoka

This inventor holds 1 USPTO granted patent and 1 EPO patent. Top assignee: Polyplastics Co., Ltd.. Active years: 2024.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Takanobu Teraoka. Retrieved from https://idiyas.com/inventor/takanobu-teraoka

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0


Average Co-Inventor Count = 1.0

ph-index = 1


Company Filing History:


Years Active: 2024

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1 patent (USPTO):Explore Patents

Title: Takanobu Teraoka: Innovator in Vibration-Damping Technology

Introduction

Takanobu Teraoka is a notable inventor based in Fuji, Japan. He has made significant contributions to the field of vibration-damping technology. His innovative work has led to the development of advanced materials that enhance the performance of various applications.

Latest Patents

Teraoka holds a patent for a "Vibration-damping molded article and method for producing resin composition for vibration-damping molded article." This invention focuses on a molded article that exhibits an improved vibration-damping effect. The vibration-damping molded article includes a resin composition that consists of at least a thermoplastic resin A, an olefin-based elastomer B with a reactive functional group, and an inorganic filler C. Notably, the inorganic filler C is coated with the olefin-based elastomer B, which enhances its performance.

Career Highlights

Takanobu Teraoka is associated with Polyplastics Co., Ltd., where he continues to innovate and develop new materials. His work has been instrumental in advancing the company's product offerings in the field of vibration-damping solutions.

Collaborations

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Conclusion

Takanobu Teraoka's contributions to vibration-damping technology exemplify the impact of innovative thinking in material science. His patent reflects a commitment to enhancing product performance through advanced engineering solutions.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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